Our new capability allows us to analyze glue bond failures by microscopically measuring the fiber size and distribution as well as penetration of the glue into the substrate. It also allows us to measure the thickness of the compressed glue film. It allows us to measure the thickness of the glue film on a label, wood panel, or a book spine. It allows us to gauge the amount of filler found in the paper stock as well as the thickness of coatings on paper.
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